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Overlay accuracy down to 2 nm enables superior yield
Interferometers alone cannot sufficiently measure stage position to satisfy double patterning (DP) requirements at 32 nm and below; therefore, the S620D Bird’s Eye Control system uses laser encoders with interferometers to accurately determine wafer position. This hybrid method improves accuracy and stability with no impact to throughput. These innovations enable superior focus control and target 2 nm overlay performance to deliver maximized yield for 32 nm applications and beyond.
The S620D has demonstrated excellent overlay performance, and achieved across-lot overlay data below 2 nm, as well as lot-to-lot stability data across three lots ≤ 2.2 nm (3σ)–fully satisfying 32 nm manufacturing requirements and approaching 22 nm targets.
Throughput up to 200 WPH provides optimal affordability
A key challenge for immersion double patterning is affordability, and S620D throughput is a critical factor in making DP cost effective for manufacturing. The S620D wafer stage uses increased scan speed and improved acceleration capabilities to decrease exposure time. In addition, the Stream Alignment wafer mapping system utilizes multiple alignment microscopes (Five-Eye FIA) and a wide area autofocus sensor (Straight Line Autofocus) that spans the wafer to dramatically reduce overhead time. Together, these innovations enable the Streamlign platform to target 200 wafers per hour, which reduces the cost of ownership and makes DP cost effective for manufacturing.
Modular design ensures rapid installation and production ramps
Being first to market with new devices can be the difference between profit and loss. To help customers meet this challenge, the S620D incorporates the new Modular 2 Structure to streamline system installation and simplify maintenance. Additionally, to extend immersion to 22 nm, the newest scanners must also provide the optimal path to profitability for IC makers. S620D system reliability has been thoroughly demonstrated by processing >4000 wafers per day and executing 24 hour wafer cycling free of any tool errors or interrupts. The S620D modular design also supports multigenerational use of this platform, with individual modules able to be upgraded as necessary to enable scanner reuse at 22 nm.
1.35 NA lens delivers world-class resolution
The S620D incorporates a multi-axial catadioptric lens with a 1.35 NA that will satisfy the imaging requirements to enable DP for 32 nm and future technology generations. This lens design delivers extremely low aberrations and minimized local flare. In addition, the S620D design enables active aberration control, and enhances CD uniformity with dose and focus feedback and tuning capabilities that further increase yield. The S620D has already satisfied the aggressive CDU requirements for lines and spaces at 32 nm, and demonstrated 22 nm patterning capabilities, confirming extendibility to next generation applications.
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NSR-S620D
